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Advanced Technologies for Industry

Instytut Technologii Elektronowej (eng. Institute of Electron Technology)

Upper organisation
Ministry of Entrepreneurship and Technology
Research Center

aleja Lotników 32/46
02-668 Warszawa


ITE performs applied rese­arch in the field of semi­con­duc­tor elec­tro­nics and phy­sics in order to deve­lop and com­mer­cia­lize inno­va­tive micro- and nano­tech­no­lo­gies and their appli­ca­tions in following areas:  IR nanophotonics; nano- and micro-technology of wideband semiconductors and transparent electronics; micro- and nano-sensors; silicon photonic devices; heterogeneous microsystems (MEMS) and sensors for multidisciplinary applications including micro- and nano-probes; nano- and micro-materials for printed electronics technology; optoelectronic detectors and radiation sources; HEMT transistors; ionizing radiation detectors; THz radiation detectors.

Institute membership in international networks:

          Sinano Institute (Silicon-based nanostructures and nanodevices)

Membership in national networks:

          IUSER platform - Smart Equipment and Systems for Distributed Power Engineering

          Polish Technological Platform on Photonics

          Mazovia Cluster ICT

          Organic Electronics Association (OE-A)

          Polish Technology Platform of Nanoelectronics and Microsystems.

Institute locations:

02-668 Warszawa, Al.Lotników 32/46   Headquarters. AIIIBV, Wide-gap, CAD and Characterization labs.

05-500 Piaseczno, Okulickiego 5E       CMOS/MEMS laboratory:

30-701 Kraków, Zabłocie 39                 Microelectronic/LTCC laboratory

01-001 Warszawa,Krakowiaków 53       Electrocompatibility/Certification .

Instytut Technologii Elektronowej (eng. Institute of Electron Technology)

Instytut Technologii Elektronowej (eng. Institute of Electron Technology)

Contact Person

is SME contact

Processing equipment for fabrication, analytical instruments for characterization  and CAD tools for design of various micro- and nano- electronic semiconductor devices:

  • AIIIBV processing line equipped with  MBE,  RIE, PECVD, photolithography, assembly and testing tools located in 350 m2 clean rooms class 100 and 1000;
  • CMOS/ MEMS technology line located in 1200 m2 area with class 10, 100 and 1000  adjusted to process silicon wafers of 4” (100 mm) and  6” (150 mm) diameter. Photolithography equipment  enables processing with the critical dimensions up to 0,9 µm;
  • Tech­no­logy line for the fabri­ca­tion of wide-gap semiconductor devi­ces set in a clean room of over 600 m2 area with class 10, 100, 1000 and 10000 sec­tions;
  • Production line for thick film hybrid microcircuits consisting of: screen printers, high temperature multizone furnaces, laser and air-abrasive trimming devices, ultrasonic bonders, fluidization bath, sealing cold welding equipment;
  •  Low Temperature Cofired Ceramic technology (LTCC) for the fabri­ca­tion multilayer electronic devices and microfluidic structures;
  • CAD tools for design of analog, digital and mixed-signal ASICs as well as  design of electronic systems based on modern microcontrollers, programmable logic and other components;
  • Laboratory of structural, optical and electrical characterization of materials and devices;

Design, technology development, small scale production and/or characterization of  semiconductor devices and electronic systems:

  • Technology development  and small scale manufacturing of: heterogeneous microsystems, Si-based photonic devices, micro- and nanoprobes, microsystems (MEMS) and sensors for medical and technical diagnostics, silicon based ionizing radiation detectors, terahertz radiation detectors;
  • Deve­lop­ment and testing of struc­tu­res and semi­con­duc­tor devi­ces based on AIII-BV com­po­unds: semiconductor laser, QCL midrange infrared and THz detectors, superlattice infrared detectors;
  • Development of wide-gap semiconductor technologies and  devi­ces: GaN based HEMT  for high power high frequency systems as well as amorphous and  transparent conducting oxides for trans­pa­rent and fle­xi­ble elec­tro­nics;
  • Modeling, simulation and testing of MEMS structures;
  • Optical, electrical and photoelectric characterization of semiconductor structures;
  • Mixed signal ASIC’s and electronic systems design;
  • Development of new materials for preparation of functional ceramic tapes with programmable properties;
  • Assembly and protection of  LTCC micromodules;
  • Techno-climatic reliability characterization of electronic components and devices;
Other activities
Band gap analysis in MIS structures using photo electric measurements
Raman analysis of chemical composition, stress, doping and temperature of semiconductor devices
Service for Industry and SMEs