Im Technologiepark 25
15236 Frankfurt (Oder)
The IHP is one of the world's leading research institutions in the field of silicon/germanium electronics. In this field, it has extensive, closely coordinated expertise in semiconductor technology, materials research, high-frequency circuit design and system solutions. Its electronic and silicon photonic technologies and circuits are among the most advanced in the world. In the speed of silicon-based transistors, IHP holds the world record with 720 GHz maximum oscillation frequency. The institute has a pilot line that manufactures circuits using its high-performance SiGe BiCMOS technologies. Through its research and manufacturing services, IHP contributes significantly to the innovative strength and technical sovereignty of Germany and Europe, especially in the field of ultrahigh-frequency electronics. The institute's research results are applied in socially important areas such as semiconductor manufacturing, wireless and broadband communications, health, space, mobility, Industry 4.0 and Agriculture 4.0.
IHP performs an important bridging function between universities and industry. The national and international "Joint Labs" with universities and universities of applied sciences are a particular manifestation of this successful cooperation.
The IHP is a founding member of the Forschungsfabrik Mikroelektronik Deutschland (FMD), the largest cross-location R&D association for microelectronics in Europe, which offers a unique range of competencies and infrastructures. FMD bridges the gap between basic research and customer-specific product development.
The cooperation in the Innovation Campus Electronics and Microsensorics Cottbus is also of great importance. This form of cooperation also offers, in particular, a strong regional interaction with partners from science and industry.
1) The core the IHP is the state-of-the-art pilot line in a 1,500 m2 DIN ISO 14644 certified clean room, which is operated 24 hours/7 days a week. An additional 300 m² of cleanroom space is available to enable wafer postprocessing/bonding and heterointegration of chiplets.
The toolset enables a specialized 0.13-µm technology line on 200-mm wafers. Cycle times are typically two days per lithography mask. Processing times from tape-in to shipping of diced chips are approximately 12 weeks, depending on the technology used.
2) Digital- and Mixed-Signal SoC Test Service (https://www.ihp-microelectronics.com/services/research-services/digital-and-mixed-signal-soc-test-service)
IHP offers a wide spectrum of services: trainings, prototyping and low volume production, design, development and ASIC testing.