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Upper organisation
Fraunhofer-Gesellschaft
Type
Non-Profit Organisation
Address

Gustav-Meyer-Allee 25
Gesundbrunnen
13355 Berlin
Germany

Description

Fraunhofer IZM specializes in industry-oriented applied research. Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Almost invisible and undervalued by many, electronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions. Modern packaging technologies make developing smaller and smaller products possible. We process ICs thinner than a sheet of paper. The institute, founded in 1993, has a staff of nearly 400 and disposes of a lab area of more than 8,000 sqm. More than 80 percent of our turnover in 2019 was earned through contract research.

Fraunhofer IZM

Fraunhofer IZM

Contact Person
Georg Weigelt
Marketing
E-mail
georg.weigelt@izm.fraunhofer.de
Equipment

SYSTEM INTEGRATION

Wafer-Level Packaging Line
Fraunhofer IZM operates two process lines (cleanroom class 10 – 1000) in Berlin (975 m²) and Dresden (ASSID, 1000 m²), that offer our customers various wafer-level packaging services from development stage to prototyping and small volume production. Different substrate materials (e. g. silicon, III/V, ceramic and glass) and wafer sizes (4” –12”) can be processed. Project and process work on both lines is executed in compli-ance with ISO 9001:2015 management standards.

Process Modules:

  • Cu-TSV integration (via-middle and via-last-processes)
  • Silicon and SiC plasma etching – DRIE (TSV, cavities)
  • Thin-film deposition (sputter, CVD, photolithography, reactive ion beam etcher)
  • PECVD process chamber (200 / 300 mm) for the deposition of TEOS oxide, Silane oxide and Silane nitride
  • High-density thin-film multilayer (Cu / polymer RDL)
  • Wafer-level bumping (Cu-Pillar, SnAg, Ni, Au, In, AuSn)
  • Wafer thinning und thin wafer dicing (blade, laser grooving and stealth dicing)
  • Wafer bonding – permanent and temporary
  • Wafer level assembly up to 300 mm (D2W)
  • Automatic inline wafer measurement system (200 / 300 mm) for layer thickness, topographies, roughness as well as TTV / warpage / bow
  • Fully automated electric wafer measurent system

Substrate Line
In the substrate 460 x 610 mm² area panel-size substrates can be prepared for resist and PCB lamination, solder resist and cover lays can be applied and developed after exposure. In our bonding lab high-precision module assembly is carried out under inert gas. New equipment in the 480 m² cleanroom allows surface preparation for assembly at reduced bonding temperatures.

Our services include:

  • Embedding of passive and active components
  • Multilayer lamination of PCB substrates
  • Realization of smallest vias, mechanically as well as with a laser
  • Quality assessment and X-ray microscopical analysis

Mold Encapsulation Lab
The lab offers various encapsulation processes, related material and package analysis and reliability characterization tools as a one-stop-shop. The focus is on FO-WLP / PLP on sensor pack-ages with freely accessible surface and on power SiPs.

  • Precision assembly and compression molding on wafer and panel level (610 x 460 mm2)
  • Redistribution in 2D (PCB-based and thin film) and 3D (TMV)
  • Transfer molding of SiPs for sensors and power
  • Process simulation and analysis of material models

Transfer to industrial production is guaranteed due to use of production equipment.

Wire Bonding Lab

  • Processing of Au-, Al- and Cu-based bonding wire materials for thin and heavy wire bonding
  • Assembly of power modules using Al / Cu- and Cu-heavy wires for quality and reliability analyses
  • Assembly of sensor packages using Cu-ball / wedge bonding for lead frames and Au / AlSi1 wires for COB processes Soldering Lab
  • Vapor phase soldering with vacuum enables manufacturing of voidless large area solder joints for power electronics
  • Fluxless soldering of printed circuit assemblies using active gas in oxygen free Nitrogen or vapor phase atmosphere
  • Hermeticity test
  • Leak testing including Helium bombing up to a pressure of 10 bar

Photonics Lab

  • Laser structuring of glass layers with optical waveguides for electro-optical boards (EOCB)
  • Shack-Hartmann-characterization of micro lenses and micro lense arrays
  • Optical and thermal characterization of LEDs and LDs
  • Research and development of optical packaging processes with an accuracy of up to 0.5 μm

 

MATERIAL ANALYSIS

Moisture Lab

  • Comprehensive simulation-based reliability assessment of humidity-induced phenomena in microelectronic components and systems
  • Surface analysis through atomic force microscopy
  • Analysis methods for sorption, permeation and diffusion of water in materials
  • Molecular-dynamic simulationLong-term Testing and Reliability Lab
  • Fast temperature cycling tests in the range from -65 °C to 300 °C
  • Temperature storage up to 350 °CPower Lab
  • Testing of hetero highly integrated of power modules
  • Active cycling of power modules for lifetime assessment
  • Calorimetric measurement of the effectiveness of highly efficient devices

 

DESIGN

High Frequency Lab

  • Free-space measuring station up to 170 GHz, Fabry-Perot resonators up to 140 GHz and THz system for HF material characterization
  • Semi-automatic sample station with thermal chamber (-60 °C to 300 °C)
  • EMC and test environment for wireless communication sys-tems in the multi-gigabit and terabit-range
  • Antenna measuring system for up to 330 GHz
  • Test lab for mm wave modules for radar and communication, signal source (AWG) and spectrum analyzer up to 325 GHz
  • Time range measuring station (sample oscilloscope up to 70 GHz / BERT up to 64 Gbit/s)Microelectronics Lab
  • Development and qualification of mechatronics systems and energy-efficient wireless sensor systems
  • PXA for range calculation, conformity checks, and failure analyses; allows the recording of very fast signals (from 162 μs)

Further laboratories include:

  • Micro Battery Lab with 10-meter battery development and assembly line
  • Laboratory for Textile-integrated Electronics (TexLab)
  • Photoelectron spectroscopy and electron spectroscopy for chemical analysis (ESCA)
  • Corrosion Lab
  • Electronics Condition Monitoring Lab (ECM) for functional tests of electronic systems under environmental stress, salt spray, shaker
  • Qualification and Test Center for Electronic Components (QPZ)
  • Thermo-mechanical Reliability Lab
  • Thermal & Environmental Analysis Lab
Services
  • Feasibility studies

  • Product Development Consultation

  • Process and Product Development

  • Manufacturing & Prototyping

  • Testing, Qualification, Reliability

  • Training

  • Lab collaborations

Service for Industry and SMEs
Yes